• 专利附录
  • 专利说明
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    • 专利摘要:
    glazing having an electrical connection element. the present invention relates to a glazing with at least one electrical connection element, comprising: - a substrate (1), - in a region of the substrate (1), an electrically conductive structure (2), - in a region of the electrically conductive structure (2), a connecting element (3) comprising at least one chrome-containing steel, wherein the connecting element (3) has a pleated region around a connecting cable (5), and wherein the pleated region of the connecting element (3) is connected with the electrically conductive structure (2) via a solder material (4).
    公开号:BR112015005357B1
    申请号:R112015005357-2
    申请日:2013-07-10
    公开日:2021-08-24
    发明作者:Mitja Rateiczak；Bernhard Reul；Klaus Schmalbuch；Lothar Lesmeister
    申请人:Saint-Gobain Glass France；
    IPC主号:
    专利说明:

    [0001] The invention refers to a panel with an electrical connection element, an economical and environmentally friendly method for its production and its use.
    [0002] The invention relates, in particular, to a panel with an electrical connection element for motor vehicles with electrically conductive structures, such as, for example, heating conductors or antenna conductors. Electrically conductive structures are customarily connected to the on-board electrical system via welded electrical connection elements. Due to the different coefficients of thermal expansion of the materials used, mechanical stresses occur during production and operation that stress the panels and can cause the panel to break.
    [0003] Lead-containing solders have high ductility, which can compensate for the mechanical stresses occurring between an electrical connection element and the panel by plastic deformation. However, due to the End of Life Vehicles Directive 2000/53/EC, lead-containing solders have to be replaced by lead-free solders within the EC. The directive is referred to, in short, by the acronym ELV (End of Life Vehicles). Their goal is to ban extremely problematic components from products resulting from the massive increase in disposable electronics. The substances affected are lead, mercury and cadmium. This concerns, among other things, the implementation of lead-free soldering materials in electrical applications in glass and the introduction of corresponding replacement products.
    [0004] A number of electrical connection elements for lead-free soldering to electrically conductive structures has been proposed. Reference is made, as an example, to documents US20070224842 A1, EP 1942703 A2, WO 2007110610 A1, EP 1488972 A1 and EP 2365730 A1. The shape of the connecting element, on the one hand, and the material of the connecting element, on the other hand, assumes critical significance with respect to the prevention of thermal stresses.
    [0005] The purpose of the present invention is to provide a panel with an electrical connection element that is particularly suitable for welding employing lead-free solder materials, in which critical mechanical stresses in the panel are avoided. Furthermore, an economical and environmentally friendly method for their production must be provided.
    [0006] The purpose of the present invention is carried out according to the invention by a panel with at least one electrical connection element according to independent claim 1. Preferred embodiments emerge from the sub-claims.
    [0007] The panel according to the invention, with at least one electrical connection element, comprises at least the following characteristics: - a substrate, - in a region of the substrate, an electrically conductive structure, - in a region of the structure electrically conductive, a connecting element that includes at least one steel containing chromium, wherein the connecting element has a pleated region around a connecting cable, and wherein the pleated region of the connecting element is connected to the electrically conductive structure via a soldering material.
    [0008] According to the invention, the electrical connection element is connected to the connection cable by pleating. The pleat connection is simple, economical and quick to produce and can be readily automated. Additional costly process steps, eg soldering the connecting element to the connecting cable, can be avoided. At the same time, a very stable connection between the connecting element and the connecting cable is provided. Since the pleated region of the connecting element (so-called crimp, that is, the region deformed by the crimping procedure) is welded directly to the electrically conductive structure and not, for example, to a section of the connecting element connected to the connection of pleating, the connecting element can be implemented with advantageously small dimensions, whereby the space requirement of the electrical contact is reduced. Furthermore, under mechanical stress of the connecting cables, in particular pulling the connecting cable, the connecting element causes only very little or no lever arm, which results in an advantageous stability of the solder connection. The pleated connecting element can furthermore have a material thickness which is clearly less than the material thickness of conventional connecting elements. As a result, mechanical stresses are reduced, on the one hand, and lower process temperatures during welding are made possible, on the other hand, whereby the risk of breakage is reduced and the processing time is shortened.
    [0009] Chromium containing steel, in particular so-called “stainless steel” or “corrosion resistant steel”, is economically available. Connecting elements made of steel containing chromium also have high rigidity compared to many conventional connecting elements made, for example, of copper, which results in an advantageous stability of the pleated connection. Chrome-containing steel has good cold moldability, which is why it is particularly suitable for producing pleated connections. Furthermore, compared to many conventional connecting elements, for example those made of titanium, steel containing chromium has improved weldability due to higher thermal conductivity.
    [0010] The connecting cable is provided to electrically connect the electrically conductive structure to an external functional element, for example, a power supply or receiver. By this, the connecting cable is guided away from the panel, starting from the connecting element, preferably beyond the side edges of the panel. The connecting cable can, in principle, be any connecting cable that is known to the person skilled in the art, for electrical contact of an electrically conductive structure, and is suitable to be connected by pleating to the connecting element (also called "contact of pleats”). The connecting cable may include, in addition to an electrically conductive core (internal conductor), an insulator, preferably polymer shielding, with the insulating shield preferably removed in the extreme region of the connecting cable, to enable an electrically conductive connection between the element of connection and the inner conductor.
    [0011] The electrically conductive core of the connecting cable may, for example, include copper, aluminum and/or silver or alloys or mixtures thereof. The electrically conductive core is preferably implemented as a stranded wire conductor, but it can also be implemented, for example, as a solid wire conductor. The cross section of the electrically conductive core of the connecting cable depends on the current carrying capacity required for the application of the panel, according to the invention, and can be selected appropriately by the person skilled in the art. The cross section is, for example, from 0.3 mm2 to 6 mm2.
    [0012] The connecting element, which includes, according to the invention, at least one steel containing chromium and is preferably made of steel containing chromium, is preferably pleated in the extreme region of the connecting cable around the electrically conductive core of the cable connection, so that a durable, stable electrically conductive connection is developed between the connecting element and the connecting cable. Crimping is done with a suitable crimping tool, per se known to the person skilled in the art, for example, crimping pliers or a crimping press. Customarily, the stapling tool comprises two active points, for example, crimping pliers jaws, which are guided against each other, by which mechanical pressure is exerted on the connecting element. The connecting element is thus plastically deformed and compressed around the connecting element.
    [0013] The material thickness of the connecting element is preferably from 0.1 mm to 2 mm, particularly preferable from 0.2 mm to 1 mm, very particularly preferable from 0.3 mm to 0.5 mm. In this material thickness range, the connecting element has, on the one hand, the necessary cold moldability for crimping. On the other hand, in this material thickness range, an advantageous stability of the pleated connection and an advantageous electrical connection between the electrically conductive structure and the connecting cable are obtained.
    [0014] According to the invention, the connecting element has a pleated region around the connecting cable. However, the connecting element need not have regions other than the pleated region, but may consist of the pleated region.
    [0015] In an advantageous embodiment, the connecting element is pleated over its entire length around the electrically conducting core of the connecting cable. The connecting element is then implemented as a whole as a crimp and only consists of the crimped region according to the present invention, which is advantageous with respect to material savings. However, the connecting element may have, in addition to the crimped section around the electrically conductive core (so-called wire crimp or conductor crimp), one or a plurality of other sections. Such another section can, for example, be crimped around the insulating shield of the connecting cable (insulating crimp), whereby a stable connection between the connecting element and the connecting cable can be obtained. The connecting element can also, for example, have short end sections, which are not affected by crimping.
    [0016] According to the invention, the pleated region of the connecting element is connected, via the solder material, to the electrically conductive structure. Here, this means a direct mechanical connection between the pleated region of the connecting element and the electrically conductive structure, via the solder material. This means that the solder material is disposed between the crimp and the electrically conductive structure, and hereby the crimp is durable and stably fixed to the electrically conductive structure. Preferably, the entire pleated region of the connecting element is connected, via the solder material, to the electrically conductive structure. This means that the weld material is disposed between the crimp and the electrically conductive structure along the entire length of the crimp. By this means, particularly stable adhesion of the connecting element to the electrically conductive structure is achieved. However, in principle, the weld material can also be arranged only between a section of the pleat and the electrically conductive structure.
    [0017] The solder material connects the pleated region of the connecting element to the electrically conductive structure of the substrate. Preferably, the solder material is not in direct contact with the electrically conductive core of the connecting cable.
    [0018] The connecting element can be implemented as an open or closed pleat. In the case of an open pleat, the connecting element is provided as a small plate, flat or pre-folded into a pleat claw. The side edges of the connecting element are then folded around the connecting cable. In a closed crimp, the connecting element is implemented as a sleeve closed in all directions (wire end ferrule), into which the connecting cable is introduced and is then deformed by crimping.
    [0019] The pleat connections can have a wide variety of shapes in cross section perpendicular to the length direction of the connecting cable. The pleat shape is determined by the pleat tool selection. A closed crimp may, for example, have an oval (oval crimp) or polygonal (eg, square crimp, hexagonal crimp, or trapezoidal crimp) cross section. One of the active points of the crimp tool may also produce a characteristic crimp structure, with the crimp structure typically arranged opposite the so-called crimp base. The pleat shape is typically named according to the characteristic pleat structure. Shapes of a closed pleat are known to the person skilled in the art, for example, as W-crimps or mandrel pleats. In the case of an open crimp, the two side edges of the connecting element folded around the connecting cable are crimped together with a characteristic crimping structure and crimped with the connecting cable. Formats for an open crimp are known to the person skilled in the art, for example, as B-crimps (or F-crimps), OVL crimps or O-crimps.
    [0020] The invention is not limited to a specific pleat shape. The shape of the pleat can be appropriately selected by the person skilled in the art, based on the individual case requirements of the mentioned shapes or other shapes known per se.
    [0021] In a preferred embodiment of the invention, the crimp is implemented as an open crimp. Since, in this case, the connecting cable does not have to be inserted into a wire-end ferrule closed in all directions, such a crimp connection is easier to produce and can be more easily automated and is therefore particularly suitable for mass production.
    [0022] In a particularly preferred embodiment, the crimp is designed as a B-crimp, in particular when the inner conductor of the connecting cable is implemented as a stranded wire conductor. The individual wires of the stranded wire conductor are deflected by the symmetry of the contact shape evenly to both sides of the contact interior, which results in advantageous stability and gas tightness of the pleated contact. However, the crimp can alternatively be designed as an OVL crimp or an O-crimp, in particular when the inner conductor of the connecting cable is implemented as a solid wire conductor. These pleat shapes advantageously resolved in slight deformation of the inner conductor. The terms used here for shaping the pleat contact are commonly known per se to the person skilled in the art and are further explained by the figures.
    [0023] The crimp width can be appropriately selected by the person skilled in the art considering the diameter of the connecting cable as well as applicable standards and is, for example, from 1 mm to 5 mm or from 2 mm to 3 mm, in particular 2.5 mm. This is particularly advantageous in view of the requirement for a small space of the connecting element and a stable connection between the connecting element and a stable connection between the connecting element and the connecting cable.
    [0024] The length of the crimp can be appropriately selected by the person skilled in the art taking into account the diameter of the connecting cable as well as applicable standards, and is, for example, from 2 mm to 8 mm or from 4 mm to 5 mm , in particular 4.3 mm to 4.7 mm, very particularly preferable 4.5 mm. This is particularly advantageous in view of a small space requirement of the connecting element and a stable connection between the connecting element and the connecting cable.
    [0025] The height of the crimp depends on the diameter of the connecting cable and can be appropriately selected by the person skilled in the art, taking into account applicable standards.
    [0026] The substrate has a first thermal expansion coefficient. The connecting element has a second coefficient of thermal expansion. In an advantageous embodiment of the invention, the difference between the first and second thermal expansion coefficients are less than 5 x 10-6/oC, particularly preferable less than 3 x 10-6/oC. Because of this, the thermal stresses in the panel are reduced and better adhesion is obtained.
    The substrate preferably contains glass, particularly preferably flat glass, float glass, quartz glass, borosilicate glass and/or soda-lime glass. However, the substrate may also contain polymers, preferably polyethylene, polypropylene, polycarbonate, polymethyl methacrylate, polystyrene, polybutadiene, polynitriles, polyether, polyurethane, polyvinyl chloride, polyacrylate, polyamide, polyethylene terephthalate and/or copolymers or mixtures thereof. The substrate is preferably transparent. The substrate preferably has a thickness of from 0.5mm to 25mm, particularly preferably from 1mm to 10mm and very particularly preferably from 1.5mm to 5mm.
    [0028] The first coefficient of thermal expansion is preferably from 8 x 10-6/oC to 9 x 10-6/oC. The substrate preferably contains glass which preferably has a thermal expansion coefficient of 8.3 x 10-6/oC to 9 x 10-6/oC, over a temperature range of 0 oC to 300 oC.
    [0029] The second coefficient of thermal expansion is preferably from 9 x 10-6/oC to 13 x 10-6/oC, particularly preferable from 10 x 10-6/oC to 11.5 x 10-6/oC, plus particularly preferable from 10 x 10-6/oC to 11 x 10-6/oC and in particular from 10 x 10-6/oC to 10.5 x 10-6/oC over a temperature range of 0 oC at 300 oC.
    [0030] The connecting element according to the present invention preferably includes a steel containing chromium, with a proportion of chromium greater than or equal to 10.5% by weight. Other alloy components such as molybdenum, manganese or niobium result in improved corrosion resistance or altered mechanical properties such as tensile strength or cold castability.
    [0031] The connecting element according to the present invention preferably includes at least 66.5% by weight to 89.5% by weight of iron, 10.5% by weight to 20% by weight of chromium, 0% by weight weight to 1% by weight carbon, 0% by weight to 5% by weight nickel, 0% by weight to 2% by weight manganese, 0% by weight to 2.5% by weight molybdenum, 0% by weight weight to 2% by weight of niobium and 0% by weight to 1% by weight of titanium. The connecting element can also include mixtures of other elements including vanadium, aluminum and nitrogen.
    The particularly preferable connecting element according to the present invention includes at least 73% by weight to 89.5% by weight of iron, 10.5% by weight to 20% by weight of chromium, 0% by weight to 0.5% by weight of carbon, 0% by weight to 2.5% by weight of nickel, 0% by weight to 1% by weight of manganese, 0% by weight to 1.5% by weight of molybdenum, 0% by weight to 1% by weight of niobium and 0% by weight to 1% by weight of titanium. The connecting element can also include mixtures of other elements including vanadium, aluminum and nitrogen.
    The very particularly preferred connecting element according to the present invention includes at least 77% by weight to 84% by weight of iron, 16% by weight to 18.5 % by weight of chromium, 0% by weight of 0.1% by weight carbon, 0% by weight to 1% by weight manganese, 0% by weight to 1% by weight niobium, 0% by weight, 1.5% by weight of molybdenum and 0% by weight weight to 1% by weight of titanium. The connecting element can also include mixtures of other elements including vanadium, aluminum and nitrogen.
    [0034] Particularly suitable chromium-containing steels are steels of material numbers 1.4016, 1.4113, 1.4509 and 1.4510 according to EN 10 088-2.
    [0035] The electrically conductive structure according to the present invention preferably has a layer thickness of 5 μm to 40 μm, particularly preferable from 5 μm to 20 μm, very particularly preferable from 8 μm to 15 μm, in particular, from 10 μm to 12 μm. The electrically conductive structure according to the present invention preferably contains silver, particularly preferably silver particles and glass frits.
    [0036] The layer thickness of the solder material is preferably less than or equal to 6.0 x 10-4 m, particularly preferable less than 3.0 x 10-4 m.
    [0037] The solder material is preferably lead free. This is particularly advantageous in view of the environmental impact of the panel with an electrical connection element according to the invention. In the context of the invention, "lead-free solder material" means a solder material which includes, in accordance with EC Directive "2002/95/EC on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment", a proportion of lead less than or equal to 0.1% by weight, preferably no lead.
    [0038] Lead-free solder materials typically have less ductility than lead-containing solder materials, so that mechanical stresses between a connecting element and a panel may be less well compensated for. However, it has been shown that critical mechanical stresses can clearly be avoided by means of the connecting element according to the invention. The solder material according to the present invention preferably contains tin and bismuth, indium, zinc, copper, silver or compositions thereof. The proportion of tin in the solder composition according to the present invention is from 3% by weight to 99.5% by weight, preferably from 10% by weight to 95.5% by weight, particularly preferably from 15% by weight to 60% by weight. The proportion of bismuth, indium, zinc, copper, silver or their compositions in the solder composition according to the present invention is from 0.5% by weight to 97% by weight, preferably 10% by weight to 67% by weight, whereby the proportion of bismuth, indium, zinc, copper or silver may be 0% by weight. The solder composition according to the present invention may contain nickel, germanium, aluminum or phosphorus in a proportion of 0% by weight to 5% by weight. The soldering composition according to the present invention contains very particularly preferable Bi40Sn57Ag3, Sn40Bi57Ag3, Bi59Sn40Ag1, Bi57Sn42Ag1, In97Ag3, Sn95,5Ag3,8Cu0,7, Bi67In33, Bi33In50Sn17, Sn77,2In20Ag2,8, Sn95Ag4Cu1, Sn95Ag4Cu1, 5,Sn96.5Ag3Cu0.5, Sn97Ag3, or mixtures thereof.
    [0039] In an advantageous embodiment, the solder material contains bismuth. It has been shown that a bismuth-containing solder material results in particularly good adhesion of the connecting element according to the present invention to the panel, whereby damage to the panel can be avoided. The proportion of bismuth in the solder material composition is preferably from 0.5% by weight to 97% by weight, particularly preferably 10% by weight to 67% by weight and very particularly preferable from 33% by weight to 67% by weight. weight, in particular from 50% by weight to 60% by weight. In addition to bismuth, the solder material preferably contains tin and silver or tin, silver and copper. In a particularly preferred embodiment, the solder material comprises at least 35% by weight to 69% by weight bismuth, 30pcpa 50% by weight tin, 1% by weight to 10% by weight silver and 0% by weight to 5% by weight of copper. In a very particularly preferred embodiment, the solder material contains at least 49% by weight to 60% by weight of bismuth, 39% by weight to 42% by weight of tin, 1% by weight to 4% by weight of silver and 0 wt% to 3 wt% copper.
    [0040] In another advantageous embodiment, the solder material contains from 90% by weight to 99.5% by weight of tin, preferably from 95% by weight to 99% by weight, particularly preferable from 93% by weight to 98 % by weight. In addition to tin, the solder material preferably contains from 0.5% by weight to 5% by weight of silver and from 0% by weight to 5% by weight of copper.
    [0041] The solder material flows out with an outflow width of less than 1 mm, from the intermediate space between the connecting element and the electrically conductive structure. In a preferred embodiment, the maximum width of the outflow is less than 0.5 mm and in particular approximately 0 mm. This is particularly advantageous with respect to reducing mechanical stresses in the panel, adhesion of the connecting element and reducing the amount of solder. The maximum outflow width is defined as the distance between the outer edges of the connecting element and the crossing point of the weld material, where the weld material falls below a layer thickness of 50 μm. The maximum efflux width is measured on the solidified weld material after the welding process. A desired maximum efflux width is achieved through a suitable selection of weld material volume and vertical distance between the connecting element and the electrically conductive structure, which can be determined by simple experiments. The vertical distance between the connecting element and the electrically conductive structure can be predefined by an appropriate processing tool, eg a tool with an integrated spacer. The maximum outflow width can even be negative, that is, pulled back into the intermediate space formed by an electrical connection element and an electrically conductive structure. In an advantageous embodiment of the panel according to the invention, the maximum width of the outflow is pulled back in a concave meniscus into the intermediate space formed by the electrical connecting element and the electrically conductive structure. A concave meniscus is created, for example, by increasing the vertical distance between the spacer and the conducting structure during the welding process, while the weld is still fluid. The advantage lies in the reduction of mechanical stresses in the panel, particularly in the critical region present with a large crossover of solder material.
    [0042] In an advantageous embodiment of the invention, the connecting element has spacers, preferably at least two spacers, particularly preferably at least three spacers. The spacers are arranged on the contact surface between the connecting element and the solder material and are preferably formed one-piece with the connecting element, for example by stamping or deep drawing. The spacers preferably have a width of 0.5 x 10-4 m to 10 x 10-4 m and a height of 0.5 x 10-4 m to 5 x 10-4 m, particularly preferably of 1 x 10-4 m to 3 x 10-4 m. By means of the spacers, a uniformly thick and uniformly fused layer of the soldering material is obtained. Thus, the mechanical stresses between the connecting element and the panel can be reduced and the adhesion of the connecting element can be improved. This is particularly advantageous with the use of lead-free solder materials, which can compensate for mechanical stresses less well due to their lower ductility compared to lead-containing solder materials.
    [0043] In an advantageous embodiment of the invention, one or a plurality of contact lugs, which serve to contact the connecting element with the welding tools during the welding process, are arranged on the side of the connecting element facing away of the substrate. Each contact shoulder is preferably convexly curved at least in the region of contact with the welding tool. The contact lugs preferably have a height of 0.1 mm to 2 mm, particularly preferably 0.2 mm to 1 mm. The length and width of the contact lugs are preferably between 0.1 and 5 mm, much preferable atmospheric pressure between 0.4 mm and 3 mm. The contact lugs are preferably implemented in one piece with the connecting element, for example by stamping or deep drawing. For welding, electrodes whose contact side is flat can be used. The electrode surface is brought into contact with the contact shoulder. For this, the surface of the electrode is arranged parallel to the surface of the substrate. The region of contact between the electrode surface and the contact shoulder forms the welding point. The position of the weld spot is determined by the point on the convex surface of the contact shoulder that has the greatest vertical distance from the substrate surface. The position of the welding point is independent of the position of the welding electrode on the connecting element. This is particularly advantageous with respect to a reproducible, uniform heat distribution during the welding process. The heat distribution during the welding process is determined by the position, size, arrangement and geometry of the contact shoulder.
    [0044] The electrical connection element preferably has, at least on the surface facing the solder material, a coating containing copper, zinc, tin, silver, gold or alloys or their layers, preferably silver. By this means, improved wetting of the connecting element with the solder material and improved adhesion of the connecting element are achieved.
    [0045] The connecting element according to the present invention is preferably coated with nickel, tin, copper and/or silver. The connecting element according to the present invention is particularly preferable provided with an adhesion-promoting layer, preferably made of nickel and/or copper, and additionally with a weldable layer, preferably made of silver. The connecting element according to the present invention is very particularly preferably coated with 0.1 µm to 0.3 µm nickel and/or 3 µm to 20 µm silver. The connecting element can be galvanized with nickel, tin, copper and/or silver. Nickel and silver improve the current-carrying capacity and the corrosion stability of the connecting element and wetting with the solder material.
    [0046] The shape of the electrical connecting element can form one or a plurality of deposits in the intermediate space of the connecting element and the electrically conductive structure. The weld deposits and wetting properties of the weld in the connecting element prevent the efflux of weld material from the intermediate space. Weld deposits can be rectangular, round or polygonal.
    [0047] The purpose of the invention is further realized through a method for producing a panel with at least one electrical connection element, in which: a) a connecting element that includes at least one steel containing chromium is connected to a cable of connection by pleating in a region, b) the solder material is applied in the lower part of the pleated region of the connection element, c) the connection element with the solder material is disposed in a region of an electrically conductive structure, which is applied to a region of a substrate, and d) the connecting element is connected, with power input, to the electrically conductive structure.
    [0048] The solder material is preferably applied to the connecting element as a platelet with a fixed thickness, volume, shape and layer arrangement. The layer thickness of the solder material platelet is preferably less than or equal to 0.6 mm. The solder material plate preferably has a rectangular shape. The lower part of the pleated region is the side which is provided to be disposed facing the substrate of the electrically conductive structure.
    [0049] The introduction of energy during the electrical connection of an electrical connection element and an electrically conductive structure preferably occurs by means of punches, thermos, piston welding, preferably laser welding, hot air welding, induction welding, welding by resistance and/or with ultrasound.
    [0050] The electrically conductive structure can be applied to the substrate by methods known per se, for example, by screen printing methods. The application of the electrically conductive structure can take place before, during or after processing steps (a) and (b).
    [0051] The connecting element is preferably used in heated panels or in panels with antennas in buildings, in particular in automobiles, railways, planes or boats. The connecting element serves to connect the conducting structures of the panel to electrical systems that are arranged outside the panel. Electrical systems are amplifiers, control units or voltage sources.
    [0052] The invention further includes the use of the panel according to the present invention in constructions or in transport means for displacement on land, in air or in water, in particular in rail vehicles or motor vehicles, preferably as a windshield, window rear, side window and/or glass roof, in particular as a heatable panel or as a panel with antenna function.
    [0053] The invention is explained in detail with reference to drawings and exemplary embodiments. Drawings are schematic representations and not true scale. The drawings in no way limit the invention. They represent:
    [0054] Fig. 1 is a perspective view of a first embodiment of the panel according to the present invention,
    [0055] Fig. 2, an A-A' cross section through the panel of Fig. 1,
    [0056] Fig. 3, a cross section B-B' through the panel of Fig. 1,
    [0057] Fig. 4, a cross section A-A' through an alternative panel according to the present invention,
    [0058] Fig. 5, a cross section A-A' through another alternative panel according to the present invention,
    [0059] Fig. 6, a cross section A-A' through another alternative panel according to the present invention,
    [0060] Fig. 7, a cross section according to the present invention,
    [0061] Fig. 8, a cross section according to the present invention,
    [0062] Fig. 8a, a cross section B-B' through another alternative panel according to the present invention,
    [0063] Fig. 9, a cross section B-B' through other alternative connecting elements,
    [0064] Fig. 10, a detailed flowchart of the method according to the present invention.
    [0065] Figs. 1, 2 and 3 represent, in each case, a detail of a panel according to the present invention, in the region of the electrical connection element 3. The panel comprises a substrate 1, which is a thermally pre-prepared single-panel safety glass. -tensioned 3 mm thick, made of soda-lime glass. Substrate 1 has a width of 150 cm and a height of 80 cm. An electrically conductive structure 2, in the form of a heat conductive structure, is printed on substrate 1. The electrically conductive structure 2 contains silver particles and glass frits. In the edge region of the panel, the electrically conductive structure 2 is widened to a width of 10 mm and forms a contact surface for the electrical connection element 3. A cover screen (not shown) is also situated in the edge region of the substrate 1. In the region of the contact surface 8, between the connecting element 3 and the electrically conductive structure 2, the solder material 4 is applied, which makes a durable electrical and mechanical connection between the electrical connecting element 3 and the electrically conductive structure 2. Welding material 4 contains 57 wt% bismuth, 40 wt% tin and 3 wt% silver. The weld material has a thickness of 250 μm.
    [0066] The electrical connecting element 3 is made of steel of material number 1.4509, according to EN 10 088-2 (Thyssenkrupp Nirosta®) with a thermal expansion coefficient of 10.5 x 10-6/oC at temperature range from 20 oC to 300 oC. The connecting element 3 is crimped along its entire length around the end region of a connecting cable 5. The connecting element 3 is thus implemented as a whole as a crimp. The connecting cable 5 includes an electrically conductive core, which is implemented as a conventional stranded wire conductor. The connecting cable 5 further includes an insulating polymeric coating (not shown), which is removed at the extreme region to enable electrical contact of the electrically conductive core of the connecting cable 5 with the connecting element 3. The length of the bare region exceeds the length L of the crimp, eg in 0.5 to 3 mm, to ensure the flexibility of the connecting cable 5.
    [0067] The connection element 3 is implemented as an open pleat. The connecting element 3 was provided for this in the panel production as a plate with a material thickness of, for example, 0.4 mm, which was bent around the connecting cable 5 by means of a crimping tool and was Durable and stably connected to connecting cable 5 by compression (crimping). The length of the connecting element 3 corresponds to the crimp length L (crimp length) and is approximately 4.5 mm; the width of connecting element 3 (crimping width B) is approximately 2.5 mm.
    [0068] The connecting element 3 is in the form of a B-crimp. The side edges of the connecting element 3 are folded around the connecting cable 5 and sunk by "drilling" the crimping tool into the electrically conductive core of the connecting cable 5, with the wire strands (not shown individually) of the cable. 5 connection deflecting evenly on both sides of the inner contact. The characteristic pleat shape presents, in profile, two rounded structures resembling the letter “B”. The characteristic crimp shape is arranged on top of the connecting element 3 facing away from the substrate 1. The contact surface 8, between the connecting element 3 and the solder material 4, is arranged opposite the characteristic crimp shape (i.e. is, on the basis of pleating). Thus, an advantageous wetting of the connecting element 3 with the solder material 4 is obtained.
    [0069] The crimp base has, in the illustrated embodiment, a flat section that makes up the substantial part of the contact surface 8. However, the crimp base can also be implemented entirely flat or curved. The base of the pleat can be implemented smooth as shown. However, the crimp base may also have burrs, as is customary in crimping technique. The burrs are preferably implemented symmetrically in the side edge regions of the pleat base.
    [0070] Fig. 4 represents a cross section along A-A' through an alternative embodiment of the panel, according to the present invention, with the connecting element 3 implemented as a B-crimp. The connecting element 3 is provided on the surface facing the solder material 4 with a silver-containing wetting layer 6, for example, with a thickness of approximately 5 µm. This improves the adhesion of the connecting element 3. In another embodiment, an adhesion promoting layer, made for example of nickel and/or copper, can be situated between the connecting element 3 and the wetting layer 6.
    [0071] Fig. 5 represents a cross section along A-A', through an alternative embodiment of the panel according to the present invention, with the connecting element 3 implemented as a B-crimp. The spacers 7 are arranged on the pleating base on the side of the connecting element 3 facing the substrate1. For example, four spacers 7, of which two spacers 7 can be discerned in the section shown, can be arranged on the contact surface 8. The spacers 7 are stamped on the connecting element 3 and thus implemented in one piece as connecting element 3. The spacers are shaped as a spherical segment and have a height of 2.5 x 10-4 m and a width of 5 x 10-4 m. By means of the spacers 7, the formation of a uniform layer of the solder material 4 is promoted. This is particularly advantageous with respect to the adhesion of the connecting element 3.
    [0072] Fig. 6 represents a cross section along A-A', through an alternative embodiment of the panel, according to the invention, with the connecting element 3 implemented as a B-crimp. The electrical connection element 3 includes, on the surface of the pleating base facing the solder material 4, a recess with a depth of 250 μm, which forms a solder deposit for the solder material 4. The efflux of the solder material 4 of the in-between space can be completely avoided. By this means, the thermal stresses in the panel are further reduced. The solder tank can also be stamped on the connecting element 3.
    [0073] Fig. 7 represents a cross section along B-B', through an alternative embodiment of the panel according to the present invention. The connecting element 3 is designed as a closed pleat. The connecting element 3 has been provided as a sleeve closed on all sides (wire end ferrule), into which the bare end region of the connecting cable 5 has been inserted. The connecting element 3 was then durable and stably connected to the connecting cable 5 by compression (crimping) as an oval crimp.
    [0074] Fig. 8 represents a cross section along B-B', through an alternative embodiment of the panel according to the present invention. The connecting element 3 is designed as an open B-crimp, as in Fig. 3. In contrast to the embodiment of Fig. 3, the connecting element 3 is arranged on the panel, so that the pleating base is turned over. away from the substrate 1 and the characteristic pleating structure faces the substrate 1 and is connected to the electrically conductive structure 2 via the solder material 4. An advantage of this arrangement of the connecting element 3 is that the rounded regions of the structure characteristic pleating can serve as spacers, whereby, in a simple way, a defined distance, between the connecting element 3 and the electrically conductive structure 2, is obtained. Furthermore, it has been shown that the rounded regions result in an advantageous distribution of the solder material 4 (formation of an advantageous solder fillet).
    [0075] Fig. 8a represents a cross section through an alternative embodiment of the panel according to the present invention, with the connecting element 3. The connecting element 3 is implemented as an open B-crimp, with the base of distended crimp facing away from substrate 1. A contact shoulder 9 can be discerned at the base of the crimp. Contact shoulder 9 is stamped on the pleating base and thus implemented in one piece with connecting element 3. Contact shoulder 9 is shaped as a spherical segment and has a height of 2.5 x 10-4 m. a width of 5 x 10-4 m. The contact stub 9 serves to contact the connecting element 3 with the welding tool during the welding process. By means of the contact shoulder 9, a reproducible and defined thermal distribution is ensured, irrespective of the exact placement of the welding tool.
    [0076] Fig. 9 represents a cross section through two other exemplary embodiments of the connecting element 3 according to the present invention, with the connecting cable 5. The connecting elements 3 are in each case implemented like open pleats. In part (a), the connecting element 3 is shaped as a so-called pleat-OVL. The side edges of the connecting element 3, folded around the connecting cable 5, overlap. In part (b), the connecting element 3 is shaped as a so-called O-crimp. The side edges of the connecting element 3, bent around the connecting cable 5, are struck flush with each other.
    [0077] Fig. 10 represents in detail a method according to the present invention, for producing a panel with an electrical connection element 3.
    [0078] The specimens were produced with substrate 1 (thickness 3 mm, width 150 cm and height 80 cm), electrically conductive structure 2, in the form of a heating conductive structure 3, according to Figure 1, and the welding material 4. Connecting element 3 is made of steel of material number 1.4509, according to EN 10 088-2, which has a coefficient of thermal expansion of 10.0 x 10-6/oC in the temperature range of 20 oC to 200 oC and a thermal expansion coefficient of 10.5 x 10-6/oC in the temperature range of 20 oC to 300 oC. Substrate 1 was made of soda-lime glass, with a thermal expansion coefficient of 8.30 x 10-6/oC, in the temperature range of 20oC to 300oC. Weld material 4 contained Sn40Bi57Ag3 and had a layer thickness of 250 µm. The connecting element 3 was welded onto the electrically conductive structure 2 at a temperature of 200 oC and a processing time of 2 seconds. Critical mechanical stresses in the panel were not observed. The connection of the panel to the electrical connection element 3, via the electrically conductive structure 2, was lastingly stable. With all specimens, it was possible to observe, with a temperature difference of +80 oC to -30 oC, that no substrate broke or showed damage. It was possible to demonstrate that, shortly after welding the panels with the welded connection element 3, they were stable against a sudden drop in temperature.
    [0079] In the comparative examples with connecting elements that had the same shape and were made of copper or brass, clearly higher mechanical stresses occurred and with a sudden temperature difference of +80 oC to - 30 oC. It was observed that the panel had more damage shortly after welding. Panels according to the present invention, with glass substrates 1 and electrical connection elements 3, according to the invention, were shown to have better stability against sudden temperature differences. This result was unexpected and surprising to the person skilled in the art.Reference Character List(1) substrate(2) electrically conductive structure(3) electrical connection element (4) solder material(5) connection cable(6) wetting layer(7) spacer(8) contact surface of connecting element 3 with electrically conductive structure 2(9) contact shoulderH crimp heightB crimp widthL crimp lengthA-A' section lineB-B' section line
    权利要求:
    Claims (14)
    [0001]
    1. Panel characterized by the fact that it comprises: - a substrate (1), - in a region of the substrate (1), an electrically conductive structure (2), - in a region of the electrically conductive structure (2), an element of electrical connection (3) comprising at least one chromium-containing steel, wherein the electrical connection element (3) comprises at least 66.5% by weight to 89.5% by weight of iron, 10.5% by weight of 20% by weight chromium, 0% by weight to 1% by weight carbon, 0% by weight to 5% by weight nickel, 0% by weight to 2% by weight manganese, 0% by weight to 2. 5% by weight of molybdenum, 0% by weight to 2% by weight of niobium and 0% by weight to 1% by weight of titanium, wherein a coefficient of thermal expansion of the connecting element (3) is 9x10-6 /°C to 13*10-6/°C over a temperature range of 0°C to 300°C, where a difference between a substrate thermal expansion coefficient (1) and a substrate element thermal expansion coefficient electrical connection (3) is less than 5 x 10-6/oC, where the element electrical connection point (3) has a pleated region around a connection cable (5) in which a lead-free solder material (4) is disposed between the plating region and the electrically conductive structure (2) so that the pleated region of the electrical connecting element (3) is directly connected to the electrically conductive structure (2) via the lead-free solder material (4), and wherein the connecting cable (5) includes a stranded wire conductor.
    [0002]
    2. Panel according to claim 1, characterized in that a material thickness of the electrical connection element (3) is from 0.1 mm to 2 mm.
    [0003]
    3. Panel according to claim 2, characterized in that the material thickness of the connecting element (3) is from 0.2 mm to 1 mm.
    [0004]
    4. Panel according to claim 2, characterized in that the material thickness of the connecting element (3) is from 0.3 mm to 0.5 mm.
    [0005]
    5. Panel according to claim 1, characterized in that the electrical connection element (3) comprises at least 77% by weight to 84% by weight of iron, 16% by weight to 18.5 % by weight of chromium, 0% by weight to 0.1% by weight of carbon, 0% by weight to 1% by weight of manganese, 0% by weight to 1% by weight of niobium, 0% by weight to 1.5% by weight of molybdenum and 0% by weight to 1% by weight of titanium.
    [0006]
    6. Panel according to claim 1, characterized in that the substrate (1) contains glass.
    [0007]
    7. Panel according to claim 6, characterized in that the substrate (1) contains flat glass, float glass, quartz glass, borosilicate glass and/or soda-lime glass.
    [0008]
    8. Panel according to claim 1, characterized in that the electrically conductive structure (2) contains at least silver and has a layer thickness of 5 μ m to 40 μ m.
    [0009]
    9. Panel according to claim 8, characterized in that the electrically conductive structure (2) contains silver particles and glass frits.
    [0010]
    10. Panel according to claim 1, characterized in that a layer thickness of the lead-free solder material (4) is less than or equal to 6.0 x 10-4 m.
    [0011]
    11. Panel according to claim 1, characterized in that the lead-free solder material (4) contains 35% by weight to 69% by weight of bismuth, 30% by weight to 50% by weight of tin 1 wt% to 10 wt% silver and 0 wt% to 5 wt% copper.
    [0012]
    12. Panel according to claim 1, characterized in that the lead-free solder material (4) contains 90% by weight to 99.5% by weight of tin, 0.5% by weight to 5% by weight of silver and 0% by weight to 5% by weight of copper.
    [0013]
    13. Panel according to claim 1, characterized in that the electrical connection element (3) is coated with nickel, tin, copper or silver.
    [0014]
    14. Panel according to claim 1, characterized in that the lead-free solder material (4) contains tin and bismuth, indium, zinc, copper, silver, or their compositions.
    类似技术:
    公开号 | 公开日 | 专利标题
    BR112015005357B1|2021-08-24|PANEL COMPRISING ELECTRICAL CONNECTION ELEMENT
    JP6104389B2|2017-03-29|Panel with electrical connection elements
    JP6440756B2|2018-12-19|Sheet glass provided with electrical connection member and compensation plate, method for producing sheet glass, and use of sheet glass
    KR101821465B1|2018-01-23|Disk comprising electric connecting element and connecting bridge
    JP6290401B2|2018-03-07|Sheet glass having at least two electrical connection members and one connection conductor
    同族专利:
    公开号 | 公开日
    DK2896269T3|2017-06-19|
    US20150236431A1|2015-08-20|
    KR101768784B1|2017-08-16|
    US20180048079A1|2018-02-15|
    CA2884777A1|2014-03-20|
    EP2896269B2|2020-06-03|
    AU2013314646B2|2016-12-22|
    AU2013314646A1|2015-04-30|
    TW201414566A|2014-04-16|
    EA201590565A1|2015-07-30|
    CN104620674B|2017-03-15|
    WO2014040773A1|2014-03-20|
    KR20150054957A|2015-05-20|
    JP2016505194A|2016-02-18|
    TWI586056B|2017-06-01|
    PL2896269T3|2017-08-31|
    DE202013012583U1|2017-08-09|
    MA37917B1|2017-06-30|
    CN104620674A|2015-05-13|
    PT2896269T|2017-06-23|
    US10297929B2|2019-05-21|
    JP6646010B2|2020-02-14|
    ES2628329T3|2017-08-02|
    ZA201501527B|2016-01-27|
    PL2896269T5|2020-10-19|
    AR092433A1|2015-04-22|
    HUE034782T2|2018-02-28|
    MX347252B|2017-04-20|
    EP2896269A1|2015-07-22|
    US9837727B2|2017-12-05|
    EA030978B1|2018-10-31|
    CA2884777C|2018-02-27|
    JP2017216239A|2017-12-07|
    DK2896269T4|2020-08-31|
    MX2015003223A|2015-07-14|
    ES2628329T5|2021-03-25|
    MA37917A1|2016-10-31|
    EP3182795A1|2017-06-21|
    BR112015005357A2|2017-07-04|
    DE202013006780U1|2013-08-27|
    EP2896269B1|2017-03-15|
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    法律状态:
    2018-12-04| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|
    2019-12-24| B06U| Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]|
    2021-03-09| B06A| Patent application procedure suspended [chapter 6.1 patent gazette]|
    2021-06-22| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|
    2021-08-24| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 10/07/2013, OBSERVADAS AS CONDICOES LEGAIS. |
    优先权:
    申请号 | 申请日 | 专利标题
    EP12184408|2012-09-14|
    EP12184408.8|2012-09-14|
    PCT/EP2013/064575|WO2014040773A1|2012-09-14|2013-07-10|Pane having an electrical connection element|
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